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Customer Verification |
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Our customer has qualified our re-ball BGA based
on the following tests: |
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Solder Ability Test
- Our BGA has passed customer
test on special designed tester and socket which is to confirm
the solder ability of the joints
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Complete Functionality Test
- Our tested BGA has also been
attached to the mother board and passed a complete testing
route begins from ATE, SIT and finnaly the FQA tester
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Reliability Test
- Temperature Cycling Test
- Humidity Test
- Vibration Test
- Drop Test
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Note: All tests follow IPC standard.
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Manufacturing Capability |
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Our Capability
- Remove all types of BGA and
Micro BGA from PCB
- Re-balling all types of BGA
& Micro BGA. The smallest size is as below:
- Package size: 6 x 6 mm
- Ball size: 0.3 mm
- Pitch: 0.5 mm
- Reattach all types of BGA and
Micro BGA to PCB
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Advantages
of Reballing BGA > |
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BGA & Micro BGA Re-balling Process > |
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